
Home About us Enterprise Introduction Basic Elements of Enterprise ISO9001 ISO14001 Quality Policy Environment Policy Products Center SMT solder pastes Lead-free solder wires Lead-free solder bars No cleaning flux H-L temperature solders Technical supports Presentation of new products plans for new products SMT technology exchange Exchange of wave solding technology SMT temperature profile Satety Data Sheet Proprietary product Contact Messages Order 中文版

Provide reliable and safe product for
the electronic industries

Technical support

Figure 1 (a) and (b).The significant difference between compound morphology at
the interface of the traditional Sn-Cu/Cu and that of SC-Co-Ni-(p)/Cu

(a)Sn-0.7Cu (b)SC-Co-Ni-P
Figure 2 The morphology of IMC after ahing at 250℃ for 24h

Figure 3. The results of the creep resistance test at the joint of Sn-0.7Cu
and SC-Co-Ni-P respectively after high temperature aging at 150℃ for 24h

Figure 4. The wettability test results of the two kinds of alloys on the surface of copper.

>> 1 2 >>