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 7-3 High temperature lead-free solder alloy development

The most challenge of the electronic manufacture products which is producted by lead-free welding is to make the solidus of Lead-free solders above 260℃. Right now, our company has been developing the hige tempreture non-tin based lead-free solder alloy system. Zn-Al-Mg based alloy and Bi based alloy primarily, which is used for high temperature lamps and lanterns as well as in chip foundation plate interconnection to solder melting point request. The preliminary test result already might control the solidus in 320℃ and about 260℃ separately, Its specific performance research also on the march.

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